Introduction: _x000D_ Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc. _x000D_ It's used in low ionic activator system, tin-run speed _x000D_ Low level of smoke,surface insulation resistance value is high residue after curing _x000D_ Therefore, the electrical properties of the cell phones and other communications products, very little interference _x000D_ Features: _x000D_ NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR _x000D_ Recommended for BGA, CSP and other solder ball array repair and fill the ball _x000D_ When using smoke less, no residue. Affordable. _x000D_ _x000D_ Suitable for: _x000D_ North and south bridge, cards, cell phone chip, video chip BGA solder, bumping _x000D_ Also can use off the tin, the effect is very ideal _x000D_ The residue was less bright spot, less smoke, no pungent odor, do not run the ball _x000D_ _x000D_ Package included:1 PC