Enhance your soldering projects with this high-performance NC-559-ASM Flux Paste, specially formulated for mobile phone PCB, BGA, and PGA SMD rework applications. Designed to deliver superior soldering quality, this flux paste features a high tin running speed and low smoke emission, ensuring a clean and efficient soldering process. Its unique formulation helps prevent oxidation during high-temperature soldering, maintaining the integrity of the solder joint and improving overall reliability. Key Features: · High Tin Running Speed & Low Smoke Emission: Provides smooth solder flow with minimal smoke, creating a safer and cleaner working environment. · Oxidation Prevention: Effectively inhibits surface oxidation of soldering materials at elevated temperatures, ensuring strong and durable solder joints. · Surface Tension Reduction: Reduces surface tension to improve solder wettability and enhance the quality of soldering results. · Wide Application Range: Ideal for use in clocks, watches, precision parts, stainless steel crafts, tableware, mobile communications, digital products, air conditioning and refrigeration equipment, glasses, knives, car radiators, various PCB boards, and BGA solder balls brazing. · Optimal Granularity & Viscosity: Features a granularity of 28 µm and a viscosity of 180 Pa·S, providing excellent paste consistency for precise and controlled application. · Compact and Portable: Comes in an approximate 100 g (3.5 oz) size, making it easy to carry, store, and use whenever needed. Specifications: · Item Type: Flux · Flux Type: NC-559-ASM · Paste Weight: Approx. 100 g / 3.5 oz · Granularity: 28 µm · Viscosity: 180 Pa·S Package Includes: · 1 x NC-559-ASM Flux Paste This NC-559-ASM Flux Paste is an essential tool for professionals and hobbyists seeking reliable, high-quality soldering performance. Its effective oxidation prevention, excellent flow characteristics, and versatile applications make it a trusted choice for precision soldering tasks across various industries.