Copper and Titanium TC4 BiMetal Heatbreak temperature capability: rated up to 500 C, suitable for demanding temp printing. Inner wall design helps reduce clogging during extrusion. BiMetal twopart design: consists of two components with different thermal conductivities. The assembly is bonded firmly to withstand regular use and avoid damage. Material and heat management: built from Copper and Titanium TC4. Titanium TC4 reduces heat upward conduction at the heating position, while Copper supports heat dissipation to accelerate heat conduction and improve overall thermal response. Durable and reliable: designed for long service life in hotend configurations that use copper and titanium bimetal heatbreaks. The twopart construction and secure bonding contribute to robustness. Compatibility: intended for standard hotend configurations that employ bimetal heatbreaks made from Copper and Titanium TC4. Performance benefits: improved heat management, reduced risk of clogging, and more stable extrusion at temperatures. Use scenarios: 1) Printing temperature materials such as PEEK and other engineering polymers that require elevated nozzle temperatures. 2) Prolonged flowrate extrusion where efficient heat dissipation is critical to maintain consistent performance. 3) Upgrading existing hotends to enhance heat management and reduce heat creep, without replacing the entire hotend assembly. Material summary: Copper and Titanium TC4. Designed to maintain integrity under temperature and deliver reliable thermal performance.