Style: WSON86X5 Clear benefits Compact, standardized surfacemount package that saves PCB area while supporting mediumpower ICs. Exposed thermal pad and leadless construction improve heat dissipation and solder joint reliability compared with equivalent SOIC/SSOP packages. Designed for automated assembly: compatible with standard pickandplace, reflow soldering, and common PCB footprint layouts. Key attributes Package type: WSON (nolead, leadframebased, exposed pad bottom). Pin count: 8 contacts. Body size: nominal 6.0 mm × 5.0 mm. Height: lowprofile surfacemount form factor suitable for dense board stacks. Compatibility: intended for ICs that require an 8pin WSON footprint; fits standard industry land patterns for WSON8 6×5 packages. Performance: good thermal conduction to PCB through the exposed pad; stable mechanical and soldering performance in reflow processes. Why you need it When PCB space is limited but thermal performance matters, this WSON86X5 style provides a compact footprint with an integrated thermal path to the board. For designs that must meet automated manufacturing and reliable soldering, the package is compatible with standard SMT assembly flows. The low profile and small footprint make it a practical choice for portable electronics, industrial modules, and compact power/frontend circuits. Typical applications / use scenarios Power management modules: mounting DCDC regulators or voltage supervisors where board space and thermal dissipation are critical. Compact sensor or interface boards: use for small controller or analog frontend ICs in handheld devices, wearables, or instrument modules. Industrial and embedded assemblies: solder into dense control boards where reliable thermal transfer and consistent reflow soldering are required. Practical considerations for designers Follow manufacturer recommended land pattern and solder paste stencil openings to ensure proper wetting of the exposed pad and outer contacts. Include an appropriate thermal via pattern in the PCB under the exposed pad when additional heat sinking is needed. Account for the 6×5 mm outline and low profile in mechanical drawings and component placement constraints. This description corresponds to the WSON86X5 package style and should be used where an 8pin WSON, 6.0 × 5.0 mm surfacemount package is required.