This listing contains 13 pieces of SMCJ130A13F transient voltage suppressor diodes in the SMC2 package. The components are RoHS compliant (suffix F) and are suitable for PCB mounting in standard SMC footprints. Key benefits Protects sensitive electronics from voltage transients and surges, helping to prevent damage and downtime. Fast response to protect circuits from fast, energy transient events. RoHS compliant with lead construction, suitable for modern manufacturing. Compact SMC package supports easy integration into power, data, and control circuits. Sold as a 13piece lot, ideal for batch use in production or work. Key attributes Functionality: transient voltage suppressor diode designed to clamp voltage spikes and protect downstream circuitry. Compatibility: designed for standard SMC (DO214AB) footprints; suitable for use in systems requiring robust surge protection. Polarity and directional characteristics are specified in the datasheet; consult for correct application. Size: SMC package (DO214AB) suitable for surfacemount assembly. Material: siliconbased TVS diode. Performance: delivers rapid transient suppression and energy handling typical of the SMCJ series; specific electrical characteristics and clamping behavior are defined in the datasheet for SMCJ130A13F. Packaging and content Quantity: 13 pieces Package type: SMC2 (SMC package family) Marking: SMCJ130A13F on each device Compliance: F indicates RoHS compliant / lead Recommended use cases Power supply input protection: shield DC power rails and regulators from surge events on industrial or telecom power inputs. Network and data interfaces: protect sensitive controller and communication circuitry on speed interfaces from transient spikes. Automotive and industrial electronics: safeguard control modules and sensor interfaces from transient events on voltage lines or automotive power rails. Solar and renewable energy electronics: provide transient protection on DC bus connections and power management circuits. Notes for installation Verify polarity and directional characteristics against the manufacturer datasheet before use. Ensure appropriate PCB footprint and heat dissipation considerations for SMC devices. Handle with proper ESD protection during assembly and rework.