Feature: 1. Built‑in 9‑axis sensor and MCU resources, including: 3‑axis 12‑bit acceleration sensor, 3‑axis geomagnetic sensor and 3‑axis 16‑bit gyroscope. 2. Built‑in for 32‑bit MCU to process software operations between various sensors, and supports for 8.1. 3. It can provide single data of three types of sensors (acceleration / geomagnetism / gyroscope) separately, and can also provide combined data. 4. Through the built‑in MCU calculation, it provides more application support for smart phones, wearable devices and other products. 5. Using for BNO‑055 chip, standard IIC/serial communication protocol, 3‑5v power supply, stable performance. Specification: Item Type: Gyroscope Sensor Module Material: Plastic Module Model: GY-BNO055 Use Chip: for BNO-055 Power Supply: 3-5V (internal low dropout stabilize voltage) Communication Method: standard IIC/serial communication protocol Package List: 1 x Module 1 x Pin Header