HYG200P10LR1P Power MOSFET TO220FB3 Transistor for Power Supply and Motor Control Replacement

HYG200P10LR1P in TO220FB3 package, 1 piece Product overview Single HYG200P10LR1P semiconductor device supplied in a TO220FB3 threelead throughhole package. Supplied as one piece for , prototyping, or smallvolume assembly. Key benefits and why you need it Clean fit for standard TO220FB3 PCB footprints: installs into common throughhole boards and supports conventional heatsink mounting practices. Simplifies replacement and maintenance: onetoone form factor reduces redesign time when swapping components in existing power circuits. Reliable mechanical format: the TO220FB3 package provides a robust threelead layout widely used in power electronics, easing handling and soldering. How it solves problems and what makes it stand out Minimizes integration effort by matching widely used PCB layouts and mounting hardware, avoiding the need for custom adapters. Singlepiece supply is useful for testing or immediate replacement without bulk ordering. The TO220FB3 package is a familiar choice for designers and technicians, which speeds up and prototyping tasks. Important attributes Function: power semiconductor device supplied under model HYG200P10LR1P (refer to your circuit documentation for electrical characteristics). Package type: TO220FB3, threelead throughhole format compatible with standard TO220FB3 footprints. Quantity: 1 piece. Size and mounting: standard TO220FB3 dimensions and pin spacing for direct PCB insertion and heatsink attachment where applicable. Handling: designed for conventional throughhole soldering and mechanical fixing methods used with TO220 family packages. Typical applications and use scenarios Power supply maintenance: direct replacement in power supply regulator boards that accept TO220FB3 components. Motor control and drives: suitable for or prototyping in motor driver circuits that use threelead power devices in TO220FB3 packaging. Industrial control and power conversion: integration into inverters, converters, or control modules that require a standard throughhole power device form factor. Compatibility note Intended for applications that accept the TO220FB3 package and the specific HYG200P10LR1P model. Verify electrical ratings and pin assignments in your system documentation before installation. Package and delivery Supplied as a single HYG200P10LR1P component in TO220FB3 packaging. Intended for straightforward replacement, testing, or lowvolume assembly use.