The TS20 TSSOP28 is a 28pin thin shrink small outline package designed for surfacemount integration. This listing includes 5 pieces of the TS20 TSSOP28 package, suitable for compact PCB designs and density assemblies. Key benefits Small footprint enables higher circuit density on compact boards, helping you shrink device size without sacrificing functionality. Standard TSSOP28 footprint compatibility allows easy replacement or rework on boards using this package type. Gullwing style leads provide reliable solder joints and compatibility with common reflow soldering processes. Plastic encapsulation provides mechanical protection for the IC during handling and assembly. Suitable for automated PCB assembly, testing, and prototyping workflows with conventional SMT equipment. Key attributes Package type: TSSOP28 Pin count: 28 Mounting style: Surface mount (SMT) Body style: Thin shrink small outline package Material: Plastic encapsulation with metal leads Quantity: 5 pieces per Compatibility and use Fits standard TSSOP28 footprints, enabling straightforward integration into existing designs that use this package. Compatible with common reflow soldering processes, making it suitable for mass production and rapid prototyping. Ideal for packaging ICs such as microcontrollers, opamps, DACs/ADCs, memory devices, and other 28pin integrated circuits in spaceconstrained applications. Use cases Replacing or upgrading an existing board that uses a 28pin TSSOP package to achieve a smaller form factor without redesigning the footprint. Prototyping and evaluation of 28pin ICs in compact development boards or test fixtures. Designing density consumer electronics or industrial equipment where PCB area savings are important. Package contents Includes 5 TS20 TSSOP28 packages as described. Notes Images and dimensions refer to the standard TS20 TSSOP28 form factor. Please verify your PCB footprint and electrical requirements to ensure full compatibility with your specific device.