Compatibility: Only compatible with M5 and M5C 3D printers. Bimetal heatbreak design: The lower threaded portion is made of Titanium TC4, while the upper portion is Copper. Titanium reduces upward heat conduction at the heating position. The inner wall of the titanium section is very smooth, with roughness less than Ra 0.3, allowing the filament to pass through more easily and reducing clogging. Twocomponent construction: This heatbreak combines Copper and Titanium with different thermal conductivities. Copper provides efficient heat dissipation to accelerate heat conduction. It is manufactured as two parts that are held firmly together with a special process, ensuring durability. temperature performance: Rated up to 500 °C, suitable for demanding tasks. Compatible with all filaments, from basic PLA to PAEKs. Use scenarios and applications: Printing temperature engineering filaments such as PAEKs on M5 or M5C printers, where stable heat management is critical. Upgrading an M5/M5C setup to improve reliability during long, temperature prints and reduce downtime due to heat creep or filament jams. Filament with higher heat requirements or aggressive temperature profiles, where the bimetal design helps maintain consistent temperature and reduce clogging risks.