NC Processing/Shielding Box Purpose and use: A compact enclosure designed for NC processing and shielding of RF components. Key benefits: Improves signal integrity by reducing electromagnetic interference; protects sensitive electronics; facilitates integration with standard RF modules. Attributes to note: Provides shielding for processing needs; compatible with typical RF assemblies; suitable for compact setups. Microwave Shielding Box, DIECast Aluminum Box C Construction and material: Diecast aluminum enclosure, model C. Key benefits: Strong shielding performance for microwave applications; durable and lightweight enclosure suitable for demanding environments. Attributes to note: Diecast aluminum build; model C designation; designed for microwave shielding applications. Professional RF Design/SMA Connector Interface and design: Box emphasizes professional RF design and includes an SMA connector for reliable frequency connections. Key benefits: Easy integration into RF systems; maintains stable connections at RF frequencies; supports precise interface with minimal assembly effort. Attributes to note: SMA connector standard; professional RF design approach. Low Noise Amplifier Box/Amplifier Case/Power Amplifier Case Purpose and use: Enclosures intended for low noise amplifiers, amplifiers, and power amplifiers. Key benefits: Shields sensitive amplifier circuits from external interference; provides a protective housing suitable for RF modules. Attributes to note: Compatible with LNA/PA configurations; shieldingoriented enclosure; versatile naming to reflect use cases. Use scenarios Lab RF prototyping and testing: Use the NC Processing/Shielding Box or Low Noise Amplifier Box to minimize external interference and preserve measurement accuracy during development and testing. Field deployed RF systems: The Microwave Shielding Box and related amplifier enclosures provide rugged protection and shielding for infield RF modules and power amplifiers. Manufacturing, , and integration: Shielded enclosures simplify assembly and testing of RF components, enabling reliable integration of LNA, PA, and SMAconnected modules.