Rework kit for reballing and soldering repairs This reballing station kit combines a reballing station, stencil holder, and welding accessories to support professional rework of a wide range of chips. It is designed to streamline reballing and soldering workflows for shops and small production runs, improving throughput and consistency while reducing manual effort and error. Key benefits Faster, more consistent reballing: the stencil holder and reballing station reduce manual alignment and solder application time, increasing production efficiency. Broad compatibility: supports reballing of CPUs, memory chips, and other BGA style components used in mobile phones, tablets, and similar electronic products. Practical and professional: the kit is built for routine use in and refurbishment environments, helping operators achieve repeatable results. Cost and time savings: by minimizing manual steps and rework, this station helps lower labor cost and shorten turnaround time. Improved conversion rates: consistent soldering and accurate stencil placement increase firstpass success and reduce scrap. Main functions and attributes Reballing station: designed for reballing a variety of chips, including CPUs and memory chips, facilitating accurate solder ball placement and reflow preparation. Stencil holder: essential tool for securing reballing stencils during paste or ball application; supports precise alignment to the target package. Welding accessories: provides the common accessories needed during rework processes and is suitable for use on mobile phones, tablets, and other consumer electronics. Compatibility: works with standard reballing stencils and common BGA component sizes used in device and component refurbishment. Performance: oriented toward improving workflow efficiency and repeatability in both bench and small production environments. Typical use scenarios Smartphone motherboard : reball BGA chips such as application processors or baseband chips after removing damaged balls, ensuring accurate stencil alignment for reliable reflow. Tablet and laptop component refurbishment: restore memory chips or other BGA packages during refurbishment operations to extend component life and reduce replacement costs. Small batch rework or prototyping: increase throughput for low to medium volume production tasks where manual reballing would be too slow or inconsistent. What the kit provides A reballing station suitable for a range of BGA packages A stencil holder to secure and align reballing stencils Welding accessories for typical rework tasks This kit focuses on practical functionality and compatibility to help technicians and workshops achieve repeatable reballing and soldering results while reducing time and manual costs.