4PCS Universal BGA Stencil for MTK CPU RAM PM Power IC Reball Direct Heat Template dkcf

This 4PCS universal BGA stencil set is specially designed for smartphone repair professionals, suitable for MTK CPU, RAM, PM power IC reballing and soldering work. Featuring a direct heat template design, it allows direct heating without complex fixtures, making operation simple and heat conduction even. This effectively improves solder ball placement accuracy and rework efficiency. The stencil is made of high-quality stainless steel, heat-resistant, corrosion-resistant, and not easily deformed. It is reusable and durable, providing a cost-effective repair solution. Each stencil hole is accurately drilled according to MTK chip pin layouts, ensuring precise solder ball positioning and uniform solder paste application, reducing cold joints and bridging issues. The 4-piece set covers common MTK CPU, RAM, and power IC specifications. Lightweight and portable, it is ideal for phone repair engineers, electronic maintenance technicians, and DIY enthusiasts. Whether for daily repair or batch rework, this BGA stencil set offers a stable and reliable reballing solution.